Q: What is BGA?
A: BGA's full name is Ball Grid Array (ball grid array structure of the PCB), which is an integrated circuit board with an organic packaging method. It has: ① package area to reduce ② function increased, the increase in the number of pins ③ PCB board soldering self-centered, easy on the tin ④ high reliability and good electrical properties, the overall low cost. BGA PCB board generally more holes, most of the customer BGA under the hole design for the finished hole diameter of 8 ~ 12mil, BGA Department of surface attachment to the hole to the size of 31.5mil, for example, generally not less than 10.5mil. BGA under the hole required plug hole, BGA pad does not allow the ink, BGA pad is not drilling.
Q: What is the BGA packaging technology and what are its characteristics?
A: BGA technology (Ball Grid Array Package) that ball grid array mounted technology. The emergence of the technology has become the CPU, motherboard South, North Bridge chips such as high-density, high-performance, multi-pin package the best choice. But the BGA package occupies a larger area of the substrate. Although the technology of the I / O pin count increased, but the distance between the pins is much larger than the QFP, thereby improving the assembly yield. And the technology uses a controlled collapse of the chip method of welding, which can improve its electric performance. In addition the assembly of the technology can be coplanar welding, which can greatly improve the reliability of the package; and by the technology to achieve the package CPU signal transmission delay is small, the frequency can be greatly improved.
Q: What is the QFP package?
A: Four side pin side flat package. One of the surface-mount packages, the pin leads to a gull wing (L) from four sides. Substrates are ceramic, metal and plastic three. From a quantitative point of view, the majority of plastic packaging. When the material is not specifically shown, the majority of cases are plastic QFP. Plastic QFP is the most popular multi-lead LSI package. Not only for digital logic LSI circuits such as microprocessors and door displays, but also for analog LSL circuits such as VIR signal processing and acoustic signal processing.
Q: What is a quad flat non-leaded package?
A: Four-side flat lead-free package. Surface mount package. Now called LCC. QFN is the name given to the japon electronic machinery industry association. There are electrode contacts on the four sides of the package. Since there is no lead, the mounting area is smaller than QFP and the height is lower than QFP.
Q: Why use IC test fixture?
A: The role of a: incoming inspection; IC quality is not visible with the naked eye, and must be detected by power, with the commonly used method to detect IC current, voltage, inductance, resistance, capacitance can not fully determine the IC's good Bad; with the IC test fixture, by running the program, analog IC test the various functions, to determine the IC is good or bad. Role two: repair testing; board out of the question, the end is the motherboard problem, or IC problem? Bad judgment! With the IC test rule with anything to say, the removal of the IC into the fixture will be able to rule out the possibility of IC; the role of three: IC separation; repair of the IC, the removal process may be damaged, With the IC test fixture can be bad IC sorted out, you can save a lot of manpower, material resources, thereby reducing the cost. Take the BGA package IC, if the IC is not sorting, bad IC paste after FCT test check out, the IC removed, to bake, clean, very troublesome, and may damage the motherboard. With IC fixture testing will not be the problem.
